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Collins Aerospace announced the release of a cloud-based solution to increase airline efficiency and sustainability. OpsCore Flight Tracking, powered by FlightAware, provides precise flight tracking for real-time decision making, which in turn facilitates the reduction of excess fuel consumption, potentially lowering costs and environmental impact.
“OpsCore Flight Tracking is designed to assist airlines with meeting the ICAO Global Aeronautical Distress and Safety System (GADSS) requirements for flight tracking, meeting the operational needs of airlines, and better serve their passengers,” said Perry Wright, associate director for Value Stream Management at Collins Aerospace. “It gives dispatchers and operation managers the data needed to mitigate disruptions, optimize the operation, and give passengers a more seamless travel experience.”
Using FlightAware’s Firehose API feed, OpsCore Flight Tracking delivers up-to-date flight position data, and also provides enhanced flight status information. FlightAware Foresight™ predictive analytics will be integrated into the flight tracking capabilities of OpsCore in 2023, bringing yet another level of analysis and awareness.
Supporting commercial airlines, business aviation and future military markets, OpsCore Flight Tracking integrates with other Collins applications and services, improving the user experience.
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.