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Arlon Electronic Materials, Rancho Cucamonga, CA, announced its entrance into the high-speed, low loss, materials market with Arlon’s upcoming “Aero” line of High-Speed materials, with the first release being the “HS-320”. Arlon’s Aero High-Speed (HS) line of materials represents a significant enhancement to the company’s product portfolio that has historically been known for primarily polyimide resin-based products.
“I am very excited to have these new materials to offer our valued customers in the AIM (aerospace, industrial and military) markets.” commented Dave Nelson, Arlon’s Global Business Development Manager. “For nearly 40 years, Arlon has been known as the company to go to when polyimide and no-flow materials are required. Now, with our Aero High-Speed product line, Arlon has a great opportunity to support our customers with world class high-speed, low loss materials, designed to meet demanding electrical requirements.”
Arlon’s first release of Aero High-Speed materials will have dielectric constants from 2.8-3.4 with loss tangency between 0.001-0.003 tested at 10 GHz. The materials will be anti-CAF, up to 9 sequential laminations, and suitable for HDI.
The first production release of Arlon’s Aero High-Speed material is slated for early 2023. Data sheets for the product will be available at: www.arlonemd.com.
Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.
Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.