Elbit Systems Wins $215M Contract to Supply Aerial Intelligence Solution to an Asia-Pacific Country
October 31, 2022 | Elbit SystemsEstimated reading time: Less than a minute
Elbit Systems Ltd. announced that it was awarded a contract valued at approximately $215 million to provide an aerial intelligence solution to an Asia-Pacific country. The contract will be delivered over a period of two years.
Bezhalel (Butzi) Machlis, Elbit Systems President & CEO, commented: “This contract award is testament to the operational edge and maturity of our technologies as well as the trust of our customers in our solutions.”
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
03/25/2024 | PRNewswireSynopsys, Inc. kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi. Ghazi discussed the unprecedented innovation opportunities and challenges that technology R&D teams face in this era of pervasive intelligence.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in