Reading time ( words)
L3Harris Technologies announced the unveiling of its Iridium Distributed Tactical Communications Systems (DTCS) mission module at AUSA’s Annual Meeting and Exposition, enabling push-to-talk voice and data for warfighters worldwide.
The mission module connects the L3Harris AN/PRC-163 multi-channel handheld tactical radio to the U.S. Space Force’s DTCS network, providing warfighters in the field secure voice and data communication without having to carry a separate Iridium satellite radio.
“This new capability enables warfighters to stay connected anywhere on the battlefield and provides commanders extraordinary versatility exercising command and control,” said Ed Zoiss, President, Space and Airborne Systems, L3Harris. “The ability to stay connected in virtually any situation allows for better planning and responsive execution of missions.”
Warfighters armed with the AN/PRC-163 and DTCS mission module can now communicate using any combination of satellite communications, mobile ad-hoc network, or line-of-sight modes even in situations when one or more connection methods are not available. Small, power efficient and easy to use, the mission module attaches directly to the AN/PRC-163, or through a tethered cable, and controlled from the radio’s existing control panel.
The mission module, a part of the Assured Reach family of communications technologies, complements L3Harris’ Falcon® radio product line, delivering networked communications to more than 700,000 U.S. and allied users around the world. With more than six decades of tactical expertise and one million radios deployed, L3Harris connects ground, sea, air and space with reliable, secure mission-critical tactical communications.
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.