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American Standard Circuits has passed their most recent AS9100:D and ISO 9001:2015 audits which cover all interconnect products for military, aerospace, medical, communications and other high-tech markets.
“Passing these intensive audits is a tribute to the entire team at American Standard Circuits,” commented president and CEO Anaya Vardya. “Because we are so heavily invested in working with the defense and aerospace market it is important that we are always up to date with our specs and qualifications. It is important to pass these audits and retain our qualifications, but it is critical that we sustain and continually improve the processes that these systems control. This is another proud achievement for our ever-growing company.”
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.