StratEdge Packaging, Assembly Services Expands for High-Frequency and High-Power Devices
September 28, 2022 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz at the International Symposium for Microelectronics (IMAPS) 2022 and BCICTS. StratEdge will be exhibiting in booth 317 at IMAPS, being held in Boston, Massachusetts on Oct. 4-5, and in booth 5 at BCICTS, being held in Phoenix, Arizona from Oct. 17-18.
StratEdge designs, manufactures, and provides assembly services for RF and microwave packages with applications in the telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole markets. The packages have ultra-low losses over wide frequencies. Their high-reliability designs have high thermal conductivity and 50 ohm impedance transition designs.
StratEdge not only makes the packages but provides complete assembly and lidding services for them. Assembly is done in StratEdge's ISO 9001:2015 facility that contains a Class 1000 cleanroom and Class 100 work areas with workstations for performing sensitive operations. Assembly services cover manual to fully automatic wire and die bonding, using wire or ribbon wedge bonding and a proprietary eutectic die attach technology. StratEdge has expertise in assembling microwave and RF devices in California since 1999.
"Working with compound semiconductors, such as gallium nitride, requires a package that can best dissipate the heat from the device while ensuring that the device is performing at its optimum potential," said Casey Krawiec, VP global sales for StratEdge. "Although the package plays the most critical part, the way the chip is packaged can also make a significant difference in the device's performance. Please stop by our booth at IMAPS or BCICTS to discuss your application."
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Europlacer Announces Introductory Promotions for 2024 IPC APEX EXPO
03/27/2024 | EuroplacerEuroplacer, a leading provider of SMT assembly solutions, is excited to announce special introductory promotions for its latest products at the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
03/21/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.