CAES’ Quad-Core LEON4FT Processor Selected for European Next-Gen Star Sensors


Reading time ( words)

CAES, a leader in advanced mission-critical electronics for aerospace and defense, is pleased to announce that it has signed a multi-year contract with Jena-Optronik to deliver flight grade GR740 quad-core LEON4FT SPARC V8 Microprocessor devices for its next-generation sensor products.

The official contract signing will take place in person at the International Astronautical Congress (IAC), in the Swedish pavilion on September 20, 2022, in Paris, France. The CEO of Jena-Optronik, Peter Kapell and CAES Gaisler Product’s General Manager, Sandi Habinc will be in attendance.

“CAES has a long line of proven LEON technology with a legacy of robustness for use in various space applications like LiDAR and star sensors so we are excited to sign this contract with Jena-Optronik and continue our heritage,” said Mike Elias, Vice President and General Manager, CAES Space Division. “In addition to delivering flight proven technology, CAES is known for its expert technical support which sets it apart in the aerospace industry.”

The CAES GR740 microprocessor was chosen for its software reuse, lower power, and increased processing power. The standard interfaces, scalable performance and ease of design enable the addition of even more capability to future missions while maintaining the same basic infrastructure for other designs/products.

Jena-Optronik, based in Thuringia, Germany, is a worldwide leader in the development and manufacturing of opto-electronic sensors for the Attitude and Orbit Control Systems (AOCS) of satellites and spacecraft. Jena-Optronik’s current generation of star sensors as well as LiDAR sensors utilize CAES’s GR712RC, a dual-core LEON3FT SPARC V8 microprocessor. 

“Given our very good experience with the prior generation LEONFT Processors, Jena-Optronik is looking forward to the next generation GR740, which will enable more computing power while meeting the required lower power for future Jena-Optronik sensor products in the coming years,” said Peter Kapell, CEO, Jena-Optronik. “We appreciate CAES as a key partner in our success in meeting more demanding future mission requirements.”

Share




Suggested Items

A Challenge Facing Aerospace Designers In 2023

01/24/2023 | Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

01/17/2023 | Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

US, Japan Sign Space Collaboration Agreement at NASA Headquarters

01/16/2023 | NASA
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.