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Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.
The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
Nolan Johnson, I-Connect007
Jeffrey Pulaski describes the recent partnership between SMT Tooling and PSA, which brings SMT Tooling’s innovation and PSA’s manufacturing capabilities together. Pulaski also shares news on product development, and what visitors to SMTA International can expect to see in SMT Tooling’s floor presence.
Andy Shaughnessy, I-Connect007
In this interview, KYZEN Executive Vice President Tom Forsythe explains his company’s plans for the upcoming SMTA International show in Minneapolis, Minnesota, Oct. 31-Nov. 3. He discusses KYZEN’s latest aqueous cleaning chemistries and the company’s focus on providing reliable cleaning equipment and accurate data for customers. "This is the latest in that expanded envelope, with better economics, and better environmental health and safety," he says. "It's all part of this trend of always trying to be a better product and deliver better value.
One of the highlights of SMTA International is the Technical Conference, where more than 100 papers will be presented across at least 30 sessions. “Work that was delayed due to the effects of COVID has been completed and the amount of material coming from the industry is impressive,” says Julie Silk, VP of technical programs. “We have a packed conference this year in Minneapolis.”