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Aireon, the world’s leading provider of space-based automatic dependent surveillance-broadcast (ADS-B) services, will deliver its flight data stream to Boeing. Boeing will use the stream to expand its advanced data analytics capabilities in its effort to further strengthen commercial air travel safety.
Aireon will provide historical aircraft data and near real-time aircraft event data via its AireonINSIGHTS product for select Boeing airplane programs.
As part of its implementation of an enterprise Safety Management System (SMS), Boeing will integrate the ADS-B data into its safety analytics tools. Recognized worldwide as an industry best practice, SMS is an integrating framework for managing safety risks. Through the use of data science and data analytics, the information will deliver insights to proactively identify hazards and monitor emerging safety trends.
“We are investing in a data stream that can be transformed into safety intelligence,” said Vishwa Uddanwadiker, Boeing vice president of Aerospace Safety Analytics. “We are adding this to our data analytics ecosystem to help predict and prevent safety risks, while identifying other opportunities to strengthen our Safety Management System.”
The global space-based ADS-B data from AireonINSIGHTS can help customers gain insights to key performance indicators on flight safety.
“The power of the Aireon data unlocks a cache of information for Boeing regarding the operations of its aircraft in the global airspace. With this integration, Boeing will have data to provide a full operational view of its fleet, and we are excited to partner with them,” said Don Thoma, Aireon CEO.
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.