Sypris Wins Electronic Warfare and Communications Program


Reading time ( words)

Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has recently received a follow-on multimillion-dollar contract award from a U.S. global defense contractor to manufacture advanced integrated electronic warfare and communications avionics system modules for one of the largest Government DoD programs. Production is expected to begin in 2022. Terms of the agreement were not disclosed.

The program is for an American family of single-seat, single-engine, all-weather stealth multirole combat aircraft that is intended to perform both air superiority and strike missions. The aircraft is also able to provide electronic warfare and intelligence, surveillance, and reconnaissance capabilities. According to news sources, the U.S. plans to purchase versions of the aircraft through 2044 and the aircraft is projected to operate until 2070.

The first operational supersonic short take-off and vertical landing stealth fighter, the aircraft emphasizes low observables, advanced avionics and sensor fusion that enable a high level of situational awareness and long-range lethality. The U.S. Air Force considers the aircraft to be its primary strike fighter for conducting the suppression of enemy air defense missions, owing to its advanced sensors and mission systems.

Sypris will produce and test the advanced integrated electronic avionics system modules for the Communications, Navigation and Identification suite of the aircraft. This system supports the simultaneous operation of multiple critical functions, such as identification of friend or foe, precision navigation, and various secure voice and data communications. 

“We are pleased to support the growth of this strategic combat aircraft platform for the defense of our nation and its allies,” said Mark R. Kane, Vice President & General Manager of Sypris Electronics. “Sypris Electronics has been involved with the production of these complex electronic assemblies for many years, and we are honored to receive this important award and continue to be a part of the program’s growing global success.”

Share




Suggested Items

Working on the Hill to Build a Future

11/08/2022 | Nolan Johnson, I-Connect007
The message can’t be emphasized enough: Producing IC substrates overseas weakens America’s position and national security. In this frank discussion with Will Marsh, president of PCBAA, he talks about his efforts to educate government policymakers on the dire need to consider the entire microelectronics ecosystem. There’s power in numbers, Will says, and he sees the association’s efforts making a difference.

Advanced Packaging Gets an Additive Upgrade

11/08/2022 | Art Wall, NextFlex
The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.