Isola Offers Material Solutions at European Microwave Exhibition
March 30, 2022 | Isola GroupEstimated reading time: 2 minutes
Isola Group will be on hand at this year’s European Microwave Exhibition, providing guidance on the best use of its advanced circuit materials for printed circuit boards. The exhibition is part of European Microwave Week, scheduled for April 2-7, 2022, in the Excel London Exhibition & Conference Centre, (London, UK). Isola’s material experts and sales professionals, including new addition Jim Francey, will welcome visitors to booth #185 to learn about the optimum circuit material choices for applications in the many markets covered by Europe’s premiere RF/microwave, radar, and wireless industry event. The exhibition runs for three days during the week, from Monday through Wednesday, April 4-6, 2022.
European Microwave Week features the 51st European Microwave Conference (EuMC 2021), the 16th European Microwave Integrated Circuits Conference (EuMIC 2021), and the 18th European Radar Conference (EuRAD 2021), along with forums on 5G, automotive, and defense/security applications. The main conference is expected to draw more than 1500 high-frequency engineering professionals while the exhibition will pack more than 300 exhibiting companies from around the world.
Isola will highlight its unique circuit materials for high-speed-digital (HSD) and RF/microwave circuits, including materials that provide “freedom of design” in challenging automotive and military radar applications, such as Astra® MT77. It provides excellent thermal stability at high temperatures and power levels with a low dielectric constant (Dk) of 3.00 at 10 GHz. Its low loss is denoted by a dissipation factor (Df) of only 0.0017 at 10 GHz. Another circuit material with low loss at RF/microwave frequencies, I-Tera® MT40 (RF/MW), available with Dk values of 3.38 / 3.45 / 3.60 or 3.75 @ 10 GHz and Df as low as 0.0028. Astra® MT77 and I-Tera® MT40 are well suited for emerging millimeter-wave (mmWave) circuit applications, such as in 5G wireless networks and automotive radars. Both are FR-4 process compatible for ease of circuit fabrication.
For circuit fabricators seeking environmentally safe solutions, Isola will show its standard TerraGreen® and higher-frequency TerraGreen® 400G (RF/MW) circuit materials. Both are halogen-free circuit materials, with little or no halogens, such as chlorine or bromine, which can form hazardous materials if a PCB is overheated or on fire. Especially for RF/microwave applications, TerraGreen® (RF/MW) circuit materials feature a stable Dk with temperature, holding to 3.45 at 2, 5, and 10 GHz and temperatures from -55 to +125°C with low Df of 0.0032 at 2, 5, and 10 GHz. The halogen-free RF/microwave circuit materials are RoHS-compliant for lead-free processes and can be used in mmWave circuits to 110 GHz.
In addition, at the European Microwave Exhibition, Isola’s representatives will explain how IS680/IS680AG laminates provide sound starting points for RF/microwave circuits in both commercial and military/aerospace RF/microwave applications. Available with a wide range of copper weights the laminates exhibit Dk values of typically 2.80 to 3.45 with Df from 0.0025 to 0.0035 from 2 to 10 GHz and maintain stable Dk and Df from -55 to +125°C.
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: