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The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design is the latest addition to I-Connect007’s comprehensive, educational library.
In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Signal integrity expert and professor Eric Bogatin says, “I’ve been in involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book.”
Nokia Principal Engineer Joe Smetana agrees: “This is an excellent primer for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing.”
Hundreds of eager readers have already downloaded this book. Get your free copy today at I-007ebooks.com/su/. We hope you enjoy The Printed Circuit Designer’s Guide to Stackups: The Design within the Design.
For more information, contact:
Kyle Burk, KBJ Engineering
As mentioned in the May issue of Design007 Magazine, design is performed, at times, in a vacuum. But it doesn’t have to be that way. Whenever circumstances allow, design should be performed by communicating with all stakeholders throughout the design process, hence the emphasis on the word with in DWM. Communication can occur through personal correspondence such as email and voice conversations or through more formal design meetings—in person or through videoconferencing. No matter which means of communication you prefer, it’s important to communicate early and often with stakeholders involved in the downstream processes as you bring your project to realization.
Andy Shaughnessy, Design007 Magazine
Despite all of the talk about the need for communication between designers and manufacturers, many PCB designers still do not talk with their manufacturers for a variety of reasons. Altium and MacroFab aim to change this dynamic. In this interview, Ted Pawela, chief ecosystem officer of Altium and head of Altium’s Nexar Business Unit, and MacroFab CEO Misha Govshteyn, discuss the new Altimade manufacturing service that Altium is introducing in partnership with MacroFab. Ted and Misha provide an overview of the Altimade process, how it links designers to fabricators, assembly providers, and component distributors, and they explain how it could pave the way for true design with manufacturing, or DWM.
I-Connect007 Editorial Team
When we want to find out what challenges our readers are facing, we just ask. And they don’t mind sharing—the good, the bad, and the ugly. In a recent survey, we asked our PCB designer readers, “Why don’t you know who is going to manufacture your boards?” Here are some of more interesting replies we received, edited slightly for clarity. Do you see yourself in these replies?