Epec Invests Over $1M in New Equipment at Netvia Location
December 29, 2021 | Epec Engineering TechnologiesEstimated reading time: 1 minute
Epec Engineered Technologies announced that it has invested more than $1M in new equipment at its NetVia Group PCB manufacturing facility located outside of Dallas, Texas.
Specifically, they have added an Orbotech Dimension 6 AOI with Microvia inspection capability, a Mivatek 200L LED laser direct imaging system, a Microcraft EMMA Flying probe electrical tester with 1000V HiPot testing capability, along with several of the newest high-end metallurgical microscopes and an automatic metallographic grinding and polishing machine to dramatically improve throughput in our laboratory.
“Since the acquisition of NetVia by Epec Engineered Technologies in November of 2020, the growth of our business has required that we increase our capacity and our equipment resilience to ensure that we can meet our customers’ delivery and technology needs. We are dedicated to ensuring that we can manufacture high-technology rigid circuit boards and rigid-flex PCBs for our customers, which will require us to increase our equipment in terms of capacity and capability every year,” stated Ed McMahon, CEO of Epec Engineered Technologies.
The equipment that has been installed is the highest technology available in terms of speed and accuracy which increases NetVia’s ability to manufacturer PCB with 3/3 lines and spaces, thousands of test points per part, and ensuring that PCBs with even the smallest microvias are inspected using machine technology.
Jeff Forbus, President of NetVia, said: “Our team is dedicated to our customer success and with the addition of this equipment we can now move even faster to help our customers get their product to market faster. Printed circuit boards require a constant focus and attention to detail and these additions are going to help us with both.”
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).