The Government Circuit: Driving Resiliency and Economic Security on Both Sides of the Atlantic
American Made Advocacy: Taking the Fight to Capitol Hill
Defense Speak Interpreted: SWaPing Nanosatellites for Defense SystemsFTG Receives $3.7M (CAD) After-Market Contract by DLA for Electronic Assemblies
September 15, 2021 | Firan Technology Group CorporationEstimated reading time: Less than a minute
Firan Technology Group Corporation has been awarded a $3.7M CAD after-market contract from the United States Defense Logistics Agency (DLA) to provide electronic assemblies to retrofit airborne radar systems on various US Armed Forces aircraft. The work will be performed at the FTG facilities in Chatsworth, California.
“We are pleased to receive this significant award. We are committed to the DLA’s mission to support and extend the service life of military aircraft,” said Brad Bourne, FTG’s President, and CEO. “We are excited about the direction of our after-market initiative providing the DLA various products including this high quality, high-reliability complex electronic assemblies.”
The award is a long-term after-market contract that enables multiple products draws, and ensures a minimum annual quantity to FTG. Initial production releases have been issued to FTG Aerospace - Chatsworth and the work is now underway.
Share on:
Suggested Items
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
IPC Releases “J” Revisions to Two Leading Standards for Electronics Assembly
04/08/2024 | IPCIPC announces the release of revisions for two leading standards for the electronics assembly industry. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering processes and materials.
Canon Taiwan Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturer’s Listing
04/04/2024 | IPCIPC’s Validation Services Program has awarded an IPC Qualified Manufacturers Listing (QML) to Canon Taiwan, a leader in the optical industry, producing single-lens reflex/mirrorless digital cameras, camera lenses, accessories and network surveillance monitors.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
IPC Releases Newest List of Standards Updates, Revisions
02/20/2024 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.