Spirit AeroSystems Europe Delivers First Set of A320 Family RTM Spoilers


Reading time ( words)

Spirit AeroSystems (Europe) Limited (UK), a subsidiary of Spirit AeroSystems Holdings, Inc., has successfully delivered the first set of new advanced composite spoilers to Airbus for the A320 Family. The spoilers are produced using Spirit’s pioneering Resin Transfer Moulding (RTM) technology and are the first to feature on a flying aircraft.

The redesigned spoiler is produced using a highly-automated advanced manufacturing, out-of-autoclave process, resulting in significantly improved manufacturing efficiencies, and reduced energy and costs compared to the original, more traditional design. Spirit is the first to industrialize this innovative composite technology in the UK aerospace sector.

Scott McLarty, SVP Airbus Programs said: “This exciting milestone is another example of Spirit’s leadership in the development of innovative wing technologies and manufacturing processes to meet our customers’ needs. We remain committed to investing in the new technologies and processes required to deliver a more sustainable aerospace industry and help meet the UK’s net zero goals.”

The spoilers are produced in Spirit’s world-class manufacturing facility in Prestwick, Scotland, using the latest automation and robotics, which included investment from the Scottish Government in the development of the technology. Such cost-effective technologies and manufacturing processes will play a central role in the development of the next generation of aircraft programs, and help Spirit increase its competitive advantage in advanced manufacturing.

Share




Suggested Items

Georgia Tech Leads Effort to Strengthen State’s Defense Manufacturing Industry

12/29/2021 | Georgia Tech
Department of Defense grant enables collaboration with Spelman College, Technical College System of Georgia, and the Georgia Department of Economic Development in pilot project

DoD Faces Growing Risks from Reliance on Lead in Electronics

12/13/2021 | Chris Peters, USPAE
Like a cancer that spreads untreated until it becomes an urgent problem, the U.S. defense community is facing a small but growing problem that is increasingly undermining U.S. military readiness and technological dominance. The problem is lead—specifically, the lead-alloy solders that traditionally have been used to attach electronic components to printed circuit boards (PCBs). Over the last 15 years, the commercial electronics industry has shifted to lead-free solders, prompted by environmental health regulations in Europe and elsewhere. However, the U.S. Department of Defense (DoD) and its contractors never made the switch and are still heavily reliant on leaded solders. Now, leaded electronics are becoming harder to find and more outdated.

NASA Innovations Will Help U.S. Meet Sustainable Aviation Goals

09/10/2021 | NASA
NASA Administrator Bill Nelson joined federal government and industry leaders Thursday at a White House event highlighting sustainable aviation and the administration’s focus on medium- and long-term goals to combat climate change.



Copyright © 2022 I-Connect007. All rights reserved.