Reading time ( words)
As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors shared their knowledge and expertise. Each company is well-known and respected for the work it is doing to advance and maintain a high standard in the industry. The premium sponsors—Taiyo America, Burkle North America, Super Dry, and Blackfox—each share five important things you need to know about their sector of the industry.
I-Connect007 has a mission as an industry leader to create and share content that is both practical and thought-provoking. We hope you enjoy these features, and stay tuned for I-Connect007’s extensive coverage of the IPC APEX EXPO, March 8-12.
To access the Top Five Things You Need to Know, please click on the links below:
Taiyo America: Solder Masks
Burkle North America: Direct Imaging
Super Dry: Moisture Management
Blackfox: Manufacturing Training
“The Top Five Things You Need to Know” are short, informative tips that will bring clarity and efficiency to your organization.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.