TTM Earns IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements QML


Reading time ( words)

IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) to TTM Technologies, Inc.’s facilities in Sterling, Virginia. and Stafford Springs, Connecticut. Following initial audits by IPC, the Sterling, Virginia. facility passed stringent fabricator requirements, while the Stafford Springs, Connecticut facility passed designer and assembler requirements, earning both facilities a spot-on IPC’s global network of rigorously vetted, trusted sources.

Requirements for certification and QML listing to IPC-1791 includes product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.

Catherine Gridley, executive vice president and president of TTM’s aerospace & defense business, said, "TTM is proud to be part of the IPC-1791 Trusted Supplier network. TTM is now certified to offer our customers a trusted solution for design services, printed circuit fabrication, and specialty assembly. This initiative is an important part of our continued commitment to our customers and the defense industry."

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize TTM Technologies, Inc.’s Sterling, Va. and Stafford Springs, Conn. facilities on becoming members of IPC's network of trusted QML suppliers."  

Share

Print


Suggested Items

RBP Discusses New Management and Plans for the Future

11/23/2021 | Nolan Johnson, I-Connect007
Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



Copyright © 2021 I-Connect007. All rights reserved.