SPARC Research Awarded Navy Contract for High-Speed Missile Technology Development

Reading time ( words)

SPARC Research has been awarded a base contract for the Missile Integration Science and Technology – Ramjet (MISTR) program from the Office of Naval Research. The initial phase of the contract will span 12 months and includes significant follow-on potential. 

The Solid Fuel Ramjet (SFRJ) is a promising high-speed ramjet propulsion system with many tactical advantages. It has been in development for years but has yet to be implemented in an operational weapon system. The MISTR program has been structured to examine the barriers to adoption of the SFRJ and to develop a structured Science and Technology program aimed at elevating the state of readiness.  The ultimate goal is to make the SFRJ a viable option for advanced warfighting capability. 

The SPARC Research team represents decades of high-speed propulsion experience and is uniquely qualified to conduct this effort for the Navy. According to SPARC Research's President Dr. Patrick Hewitt, "The MISTR program is well-timed to support emerging long-range supersonic and hypersonic missile propulsion needs for the warfighter. Almost across the board, user requirements seek to increase missile range and speed, and the SFRJ is one of the most attractive propulsion options available – if a number of technology challenges can be addressed."

The MISTR program will benefit from a large database of prior SFRJ research activities. This history will be complimented with additional tasks under the contract as needed to enable the SFRJ to compete favorably for future propulsion requirements.



Suggested Items

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

12/01/2020 | I-Connect007 Editorial Team
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.

Copyright © 2021 I-Connect007. All rights reserved.