Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

---

The dissipation of heat from electronic power modules is increasingly critical to maintain their functionality and increase their reliability. Insulated metal substrates (IMS) offer a proven route to thermal management, and this specialist technology is increasingly employed in multilayer stack-ups for power applications.

This Realtime with... I-Connect007 roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer. The benefits of technical and engineering support from a one-stop laminate supplier become clearly apparent.

To download the audio of this roundtable discussion (mp3) file to listen on the go, click here.

To download the PDF transcript booklet of this rountable, click here.

Related Content:

• The Printed Circuit Designer's Guide to...™ Thermal Management with Insulated Metal Substrates

• Tec-Thermal IMS Series

• Solder Joint Reliability With IMS Materials
• Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

11/24/2020 | Jeff Demmin, Keysight Technologies

Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

10/27/2020 | Happy Holden, I-Connect007

The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.

10/20/2020 | Anaya Vardya, American Standard Circuits

Continuing with Part 4 of the discussion on understanding the military PCB performance standard MIL-PRF-31032, Anaya Vardya explains how the next step in the process is to create four new procedures to address the unique requirements of the military.