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Intel Announces New Program for AI PC Software Developers and Hardware Vendors

03/27/2024 | Intel Corporation
Intel Corporation announced the creation of two new artificial intelligence (AI) initiatives as part of the AI PC Acceleration Program: the AI PC Developer Program and the addition of independent hardware vendors to the program.

SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability

03/26/2024 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,

Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX EXPO 2024

03/26/2024 | Ventec International Group
Ventec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX EXPO 2024, April 9-11 on booth # 4309.

RTX's Raytheon Lower Tier Air, Missile Defense Sensor Detects and Engages Complex Target

03/25/2024 | RTX
Raytheon, an RTX business, announced that its Lower Tier Air and Missile Defense Sensor, or LTAMDS, continues to advance through its U.S. Army test program with another successful live-fire event. Military leaders from seven nations were on-site to witness the radar's capabilities and performance first-hand.

IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture

03/22/2024 | Marcy LaRont, PCB007 Magazine
The International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.
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