Jaunt Air Mobility Establishes Access Skyways to Support Integration of Advanced Air Mobility
October 23, 2020 | Globe NewswireEstimated reading time: 1 minute
Jaunt Air Mobility announced the establishment of Access Skyways, a group of partner companies providing expertise to support the integration of Advanced Air Mobility.
Jaunt announced memorandums of understanding with the following organizations; PS&S Integrated Services, an architectural and engineering firm with experience in vertiport design, and PRICE Systems, which specializes in predictive cost modeling and has the capability to calculate passenger demand for air taxi services. Jaunt is currently working with operators and other AAM initiatives globally.
“As a manufacturer of the Jaunt Journey, eVTOL (electric Vertical Takeoff and Landing) aircraft, we are committed to supporting operators in addressing the requirements to facilitate the integration of this generation of environmentally friendly aircraft,” stated Martin Peryea, CEO.
“In the very near future, people will have the opportunity to take an air taxi to reduce commute time to city centers, airports, and to connect with mass transit systems. As a company, we recognize the importance of developing operational requirements to design safe and accessible vertiports. Our Access Skyways partners bring significant experience to the process – from concept to operations,” noted Simon Briceno, Chief Commercial Officer.
Jaunt Air Mobility LLC is a transformative aerospace company. They design and build piloted and autonomous eVTOL (electric Vertical Takeoff and Landing) aircraft for urban and regional mobility, addressing multiple markets. Jaunt Journey combines the performance of an airplane with the vertical take-off and landing efficiency of a helicopter. Jaunt offers the safest, quietest, most operationally efficient aircraft. Jaunt Air Mobility was named an Uber Elevate partner in 2019.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.