BAE Systems Managing Technology for Army Cyber Command


Reading time ( words)

The U.S. Army has awarded BAE Systems a one-year, $11.7 million contract to provide information technology (IT) services to the Army Cyber Command (ARCYBER) to assist with the operation, maintenance, and technical aspects of the ARCYBER enterprise IT environment.

The company will provide system integration and management, including network and systems administration, and cyber and IT engineering support at ARCYBER Headquarters in Fort Gordon, Georgia.

“We’re pleased to continue supporting ARCYBER’s G-6,” said Peder Jungck, vice president and general manager of BAE Systems’ Intelligence Solutions business. “Our trusted, cleared IT and cyber experts are dedicated to meeting the needs of our customers and ultimately assisting warfighters with the defense of cyberspace and information operations missions.”

BAE Systems is utilizing its Federated Secure Cloud approach and processes to implement and maintain ARCYBER’s Multiple Independent Levels of Security (MILS) virtual desktop infrastructure. The company will operate and maintain the Command, Control, Communications, Computers and Information Management/Enterprise Information Technology Service Management environment for ARCYBER. 

Share

Print


Suggested Items

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

12/01/2020 | I-Connect007 Editorial Team
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.



Copyright © 2021 I-Connect007. All rights reserved.