American Standard Circuits Now Offers Copper Filled Blind Vias


Reading time ( words)

With the use of Uyemura’s Thru-Cup EVF-R plating chemistry, ASC has added acid copper plating filled blind vias to their product capabilities. Copper filled vias lend themselves to stacked via technology, achieved using laser formed or mechanically drilled vias.  Traditionally a staple in consumer products, ASC is seeing increased demand in this technology for high reliability applications.  The ability to fill between 0.0039-0.010” vias at aspect ratios up to 1:1 greatly expands ASC’s capabilities in that market space and further meeting the reliability demands.

American Standard Circuits’ President and CEO Anaya Vardya stated, “We have been producing boards with epoxy filled vias for many years now and that has become pretty standard technology. In the past 24 months we have seen an increasing demand for copper filled vias, so much so that we knew we needed to provide this technology as well. Adding copper filled blind vias puts us in a great position to meet even more customer needs as the demand increases.”

About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question go to www.asc-i.com.

Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:

The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
The Printed Circuit Designer’s Guide to Thermal Management: A Fabricator’s Perspective

 

 

Share

Print


Suggested Items

EIPC Technical Snapshot: PCB Surface Finishes

12/28/2020 | Pete Starkey, I-Connect007
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

Prices of Copper-Clad Laminates Continue to Rise

12/18/2020 | I-Connect007 China Team
Forces within and outside the PCB industry have led to concerns over rising prices for raw materials of copper-clad laminates (CCL). Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers. Prices have risen steadily in 2020, with leading CCL manufacturers announcing price increases of 20-30% recently. As the cost of raw materials such as electronic copper foil, resin and glass fiber have risen, the cost for manufacturing CCL has taken off as well.

Happy Holden: ECWC15 Virtual Event a Success

12/15/2020 | Happy Holden, I-Connect007
This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.



Copyright © 2021 I-Connect007. All rights reserved.