Microchip Expands Solutions With New High-Speed Analog-to-Digital Converter Family


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System designers have limited options for small, robust, feature-rich high-speed ADCs for extended-temperature operation. Microchip Technology Inc. announced it has filled this gap with its MCP37Dx1-80 family, the company’s second pipelined ADC offering and first to combine 80 MSPS in a choice of 12-, 14- and 16-bit resolutions, integrated digital features and qualification to a higher temperature range, including Automotive Electronics Council (AEC) Q100. 

“Our latest ADCs meet growing customer demand for robust devices that can be used in high-temperature applications and offer integrated digital processing functions that simplify design and reduce overall development costs,” said Bryan Liddiard, Vice President, Mixed-Signal and Linear division at Microchip. “The MCP37Dx1-80 family joins Microchip’s 200 MSPS ADCs to expand our high-speed offering into a much broader range of system design concepts.”

Microchip’s MCP37Dx1-80 ADCs enable a wide variety of aerospace and defense, industrial and automotive systems that require a high level of reliability. Key ADC device features include:

  • Robust and reliable design architecture: The ADCs operate over a -40°C to +125°C temperature range and are among the few high-speed ADCs in the industry qualified to AEC-Q100 grade 1 standards. This makes them ideal for demanding applications such as Advanced Driver Assistance Systems (ADAS), autonomous driving, Low Earth Orbit (LEO) satellites and test and measurement equipment.
  • Integrated digital features that eliminate external components and reduce MCU post-processing: Decimation filters improve signal-to-noise ratio (SNR), while a digital down-converter (DDC) supports communication designs and a noise-shaping requantizer in the 12-bit ADCs improves accuracy and performance.
  • Small size: Their compact 8mm x 8mm 121-pin ball grid array (BGA) packages with 0.65mm pitch also include built-in reference decoupling capacitors that further reduce cost and overall footprint by eliminating the need for external bypass capacitors.

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