Kongsberg Geospatial Integrates the World’s Highest Resolution 3D Terrain Data
September 14, 2020 | PRWEBEstimated reading time: 1 minute
Kongsberg Geospatial, developer of the TerraLens Geospatial SDK, and Vricon, a Maxar Company and geospatial intelligence data provider based in McLean, VA, announce that they will be demonstrating the world’s highest globally available 3D terrain resolution in a UAS ground control station in an upcoming online seminar hosted by the Association for Unmanned Vehicle Systems International (AUVSI).
The webinar will address the issue of flight safety while operating drones in convoluted environments and urban airspaces by using a combination of high-resolution terrain data that accurately plots the altitude and position of obstacles like buildings and towers, and real-time LoS (line of sight) calculations. The two technologies can be useful tools for collision avoidance in situations where it is necessary to operate unmanned aircraft in near proximity to buildings, powerlines, radio towers, and other infrastructure.
The webinar will also demonstrate how real-time Line-of-Sight (LoS) calculations can be used to predict problem areas for signal propagation and to help ensure effective sensor coverage.
Operation of drones in urban environments lack the accurate presentation of a digital surface model (DSM) to enable the situational awareness to avoid buildings. “In addition to building avoidance, it can be dangerous to lose the data connection with a UAV in the middle of a mission” explains Paige Cutland, Vice President at Kongsberg Geospatial, and one of the presenters. “However, using high-resolution data from Vricon and real-time LoS calculations, you can discover problem areas along your mission route ahead of time and adjust your flight plan to prevent problems before they happen.”
The geospatial data for this demonstration and seminar is being provided by Vricon, a Maxar company. Jonas Dehlin from Vricon will describe how to obtain and set up the best available geospatial data for a given mission area and demonstrate the level of detail that can be obtained through the use of high-resolution 3D surface models.
The presentation will feature 3D maps populated with 3D surface model data, which provide an extremely high level of fidelity, and high-resolution 3D globe terrain data that is useful for Line of Sight calculations.
The online seminar will be hosted on September 16th, at 3:00pm EDT by AUVSI.
Suggested Items
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRELeaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.