Digi-Key Electronics Partners for Global Distribution with Septentrio
September 2, 2020 | Digi-Key ElectronicsEstimated reading time: 1 minute
Digi-Key Electronics, a global electronic components distributor, announced that it has partnered with Septentrio, a leader in high-precision GNSS positioning solutions. Digi-Key now offers mosaic-X5™ globally for customers who need secure and reliable high-accuracy positioning in a compact and low-power form factor.
Septentrio's mosaic-X5 features complete multi-frequency multi-constellation technology and tracks every existing and future signal from all Global Navigation Satellite System (GNSS) constellations. Such signal diversity coupled with advanced anti-jamming technology allows mosaic-X5 to deliver centimeter-level positioning with maximum availability even in challenging industrial environments. This makes mosaic-X5 an ideal positioning solution for applications such as robotics, automation, telematics and many more.
"Our mosaic-X5 is an advanced GNSS receiver module without performance compromises. With its small form factor and low-power design, mosaic-X5 brings high-performance positioning to volume applications," said Francois Freulon, head of product management for Septentrio. "Having Digi-Key as a distributor enables us to scale and reach out to find new markets and applications where secure high accuracy positioning is required."
"Digi-Key is excited about the new partnership with Septentrio," said David Stein, vice president of global supplier management for Digi-Key. "Demand for high-accuracy GNSS receivers with secure and robust positioning is growing strongly, as they continue to be implemented into new applications and devices. Digi-Key offers customers an easy path to order, develop, and deploy with the latest technologies available, including Septentrio's robust and precise GNSS devices, which have the latest anti-jamming and anti-spoofing technology."
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).