TopLine Files for US Patent for Pb-free Solder Column
August 12, 2020 | TopLineEstimated reading time: Less than a minute
TopLine Corporation announced that Martin Hart, CEO of TopLine and inventor, has filed for a US Patent for a lead (Pb) free solder column used in the manufacture of Field Programmable Gate Array (FPGA) devices. The unique new product has been developed in anticipation of RoHS requirements for Pb free columns.
In making the announcement, Hart said, “Historically, the aerospace and defense industry has largely been exempt from meeting the requirements of the EU RoHS directive regulating the use of lead in solder columns. It is widely speculated that one day, RoHS will stop renewing its exemption allowing lead bearing solder balls and solder columns. Doing so could trigger unintentional consequences by forcing Original Design Manufacturers (ODMs) to convert to fully lead-free FPGA products. This product is designed to anticipate and meet future needs for lead-free columns.”
Heritage hardware used in the Aerospace and Defense industries are built on a platform of FPGA devices built with solder columns instead of solder balls, Hart adds. Column Grid Array (CGA) FPGA packages engaged in mission-critical black box systems have shown to be more reliable than Ball Grid Array (BGA) packages, absorbing stress and increasing solder joint reliability under harsh operating conditions.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.