Summit Interconnect Adds John Vaughan to Lead Strategic Market Initiatives

Reading time ( words)

Summit Interconnect, Inc. is pleased to announce the addition of PCB and EMS industry veteran John Vaughan as Vice President of Strategic Markets.

His near forty year career in the electronics industry has been comprised of senior management roles in both the PCB industry (engineering, operations, business development) and the EMS sector (Corporate VP Sales and Marketing, Director of Supply Chain, and Director of Operational Planning).

He is a widely recognized subject matter expert (SME) in military programs and the associated DOD budget analysis, strategic planning, and business capture processes.

John is also a major contributor to the broader industry through his roles with IPC (Trusted Source Task Force), TESG (Trusted Electronics Supplier Group), SMTA (VP Technical Programs), and NDIA (Electronics Working Group Member in response to Executive Order 13806).

To leverage his broad experience, John will have a multi-faceted role at Summit that includes market intelligence analysis and dissemination, corporate strategic planning, assisting in the integration of acquired businesses into the Summit portfolio, corporate marketing, sales rep management and new business development responsibilities across select end markets in the United States and globally.

“We are excited to have John on the Summit team, said Clay Swain Senior Vice President of Sales and Marketing.   We have known John for a number of years through our mutual work in the industry and have a great amount of respect for the work he has done.  John will be a great asset for our company to help us further grow our business and enhance the value we offer to our customers and stakeholders.”


Suggested Items

Myths vs. Facts: The Printed Electronics Roundtable, Part 1

08/11/2022 | Andy Shaughnessy, Design007 Magazine
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this first part of the roundtable, the participants dispel 10 common myths that have been floating around regarding printed electronic circuits (PEC). They also discuss the progress that’s been made in PEC development in just the past decade, and what the future may hold for this technology.

FLEX Conference 2022: If You Build It, We Will Buy It

07/13/2022 | Nolan Johnson, I-Connect007
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.

Flex on the Brain: The Future of Neural Interfaces

10/26/2020 | Andy Shaughnessy, Design007 Magazine
The SMTA Additive Electronics TechXchange took place virtually on October 14, with presentations from a wide variety of technologists involved in additive processes. Andy Shaughnessy describes how one of the highlights was a presentation titled “Flexible Electronics for Neural Interfaces” by Dr. Jonathan Viventi, assistant professor of biomedical engineering at Duke University.

Copyright © 2022 I-Connect007. All rights reserved.