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Indium Corporation Experts to Present at SEMI THERM

03/07/2024 | Indium Corporation
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.

E2IP Technologies Joins STMicroelectronics Partner Program

02/28/2024 | PR Newswire
E2IP Technologies, a global printed electronics and embedded system technologies innovation leader of the Human Machine Interface (HMI) and Industrial Internet of Things (IIoT) sectors, announces that it has joined the STMicroelectronics Partner Program. This collaboration is the culmination of our close-knit relationship and shared vision with ST, resulting in a powerful synergy that amplifies the value we bring to our esteemed customers.

Aegis Software’s Latest Updates to the FactoryLogix MES Platform Enable Unmatched IIoT from Both Humans, Machines

03/30/2023 | Aegis Software
Aegis Software, a global provider of Manufacturing Operations Management Software, announces new capabilities in their latest FactoryLogix® 2023.1 and 2023.2 releases.

iNEMI Packaging Tech Topic Series Evolution of Power Packaging

03/23/2023 | iNEMI
Make plans to join us for iNEMI’s March Packaging Tech Topic webinar. Power electronics have become increasingly important in modern electronic systems.

Indium Corporation’s Dr. Andy Mackie to Present as Part of iNEMI Packaging Series

03/22/2023 | Indium Corporation
Indium Corporation’s Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Tech Topic Series on Tuesday, March 28.
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