RBP Chemical Technology Announces the Release of ONYX™ Direct Metallization System for PCBs


Reading time ( words)

RBP’s ONYX™ is a Direct Metallization System for high reliability and complex printed circuit boards.

The RBP ONYX™ Direct Metallization Process is an integrated system based on a highly conductive form of finely dispersed graphite. Extensively tested and validated, the ONYX™ Process has proven to be versatile and cost effective. Currently the customer base using ONYX™ processes flex, rigid-flex, HDI and high aspect ratio multilayer printed circuit boards with ease and cost effectiveness when compared to conventional electroless copper. The ONYX™ process easily surpasses industry reliability standards including IST (interconnection stress test) and ATC (accelerated thermal cycling).

ONYX™ Direct Metallization System Highlights

The ONYX™ Direct Metallization System is a versatile process and is used in horizontal conveyorized equipment or in vertical immersion mode. Fabricators are able to process a vast array of resin materials including PTFE, polyimide, BT, flex, and basically all epoxy-based resin systems on the market today.

This process is an alternative to electroless copper deposition and provides several significant benefits to the fabricator:

  • Less expensive than conventional electroless copper
  • Smaller equipment footprint compared to electroless copper
  • Greatly reduced water consumption, 4−6 gallons/minute, compared to conventional electroless copper, 26−30 gallons per minute
  • ONYX™ contains no chelator as opposed to electroless coppersimplifying waste treatment

About RBP

RBP Chemical Technology is a leading supplier of proprietary chemicals for printed circuit fabrication and semiconductor test applications. RBP’s chemical formulas are tailored to meet the precise needs and requirements for advanced circuit boards, primarily in aerospace, medical and military applications. Headquartered in Milwaukee, Wisconsin and expanding globally, RBP is certified to ISO 9001:2015 and is the Intelligent Choice for the electronics industry.

Share

Print


Suggested Items

IPC Europe Shares Technical Education and Standards Awareness

04/22/2020 | Pete Starkey, I-Connect007
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

Congratulations to Bhanu Sood! Dieter Bergman IPC Fellowship Award Recipient

03/16/2020 | Patty Goldman, I-Connect007
Patty Goldman speaks with Dr. Bhanu Sood of NASA, Dieter Bergman IPC Fellowship Award recipient, about his extensive involvement with IPC on many committees developing standards to his work teaching professional development courses and mentoring young engineers.

Show & Tell Feature: Happy’s Highlights

03/12/2020 | Happy Holden, I-Connect007
Happy Holden traveled to San Diego for IPC APEX EXPO 2020. He was happy to get out of Grand Rapids, where the temperature had dropped to 28 degrees. In this article, he describes some of the highlights of the show, from beginning to end.



Copyright © 2020 I-Connect007. All rights reserved.