BAE Systems Secures $188 Million Contract for U.S. Navy’s AEGIS Combat System
March 3, 2020 | BAE SystemsEstimated reading time: 1 minute
BAE Systems Inc. was awarded a five-year $188.2 million contract to provide the U.S. Navy’s AEGIS Technical Representative (AEGIS TECHREP) organization with critical large-scale system engineering, integration, and testing expertise for the AEGIS Weapons and Combat Systems aboard U.S. Navy surface combatant ships.
“BAE Systems personnel have worked side-by-side with Navy sailors and civilians for nearly 40 years to strengthen and modernize the fleet of AEGIS-equipped surface ships,” said Mark Keeler, vice president and general manager of BAE Systems’ Integrated Defense Solutions business. “Our team brings a wealth of AEGIS combat system expertise with the agility, innovation, and technical acumen to ensure the U.S. Navy has the safe and effective combat capability it needs to meet mission objectives.”
As part of the AEGIS Technical Representative Engineering Support Services contract, BAE Systems will provide Navy acquisition managers with on-site leadership and systems engineering to validate Total Ship Combat design at Navy sites in Mt. Laurel, New Jersey; Bath, Maine; and Pascagoula, Mississippi. The company also will support systems engineering and test and evaluation personnel to provide fleet experience and operational insight. Additionally, the company will provide logistics, cybersecurity, production, acquisition, and waterfront support required for upgrading and maintaining development of AEGIS Combat System capabilities and baselines across the entire life cycle.
BAE Systems delivers a broad range of services and solutions enabling militaries and governments to successfully carry out their respective missions. The company provides large-scale systems engineering, integration, and sustainment services across air, land, sea, space, and cyber domains. BAE Systems takes pride in its support of national security and those who serve.
Suggested Items
Real Time with... IPC APEX EXPO 2024: MYCRONIC's Evolution and New Solutions
04/17/2024 | Real Time with...IPC APEX EXPOHenry Crandall interviews Kevin Clue, the vice president of global sales for MYCRONIC's High Flex division. They discuss the company's evolution, emphasizing its strong customer relationships and its role as a versatile, turnkey solution provider. Kevin unveils new solutions launched at IPC APEX EXPO, including an AI-integrated inspection system and the A40 pick-and-place platform. The conversation also touches on the increased use of AI and deep learning.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas
04/16/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.