Meet John Watson, I-Connect007 Columnist

Reading time ( words)

Meet John Watson, CID, one of our newest I-Connect007 columnists! John’s columns will cover a variety of tips that designers need to know.

John Watson has been in the electronics industry for 40 years, with 20 of them being in PCB design. His career started in the U.S. Army in the early ‘80s, where he worked as an electronics technician on top-secret military systems. In the early ‘90s, the electronics industry changed how repairs were done, going from a component level to board level. With that, John re-invented himself, moving into the PCB design field.

Now, John is the senior PCB engineer for Legrand Corporation, where he leads 60 designers who are spread across the United States and Asia. John’s career also includes being a consultant to some of the top electronics companies in the world, emphasizing the PCB design process and data management. In addition, he is a highly sought-out writer, mentor, and speaker.

Read "Elementary, Mr. Watson" in the Design007 Week Newsletter. Subscribe today!

10/26/2020 | Andy Shaughnessy, Design007 Magazine

Andy Shaughnessy speaks with Brad Griffin, product marketing director for Cadence Design Systems, about their new Clarity 3D Transient Solver, which is designed for system-level EMI simulation. Brad explains how the new solver, based on the company’s matrix technology, can yield results 10 times faster than existing solvers when simulating IC packages, PCBs, and SoIC designs.

10/23/2020 | Andy Shaughnessy, Design007 Magazine

After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.

09/09/2020 | I-Connect007 Editorial Team

The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.