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Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3

03/18/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the Snapdragon® 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more Android flagship smartphones, for extraordinary, premium experiences.

Anda Technologies to Feature Large Platform Conformal Coating and Plasma Treatment Systems at 2024 IPC APEX EXPO

03/15/2024 | Anda Technologies
Anda Technologies, a leading provider of fluid application and custom automated manufacturing equipment, will showcase its latest innovations at Booth 1038 during the 2024 IPC APEX EXPO.

Qualcomm Announces Shortlisted Teams for the Qualcomm Vietnam Innovation Challenge 2024

03/13/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced the shortlisted companies for the Qualcomm® Vietnam Innovation Challenge 2024 (QVIC) program.

Nepes Expands IC Packaging Capabilities for the 3D-IC era with Advanced Design Flows from Siemens

03/08/2024 | Siemens
Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.

Murray Percival Co. Empowers Emerald Technologies with Cutting-Edge Ersa Versaflow 4

03/07/2024 | Murray Percival Company
The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, has successfully facilitated the sale of an Ersa Versaflow 4/55 Selective Soldering Machine to Emerald Technologies Saline, MI location, a leading electronics manufacturing service provider.
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