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American Made Advocacy: Going Beyond the CHIPS Act to Power American Manufacturing

03/26/2024 | Travis Kelly -- Column: American Made Advocacy
Where have all the factories gone? A tour of America’s former bustling manufacturing communities is a stark reminder that, for the past three decades, we let the microelectronics manufacturing ecosystem disappear overseas, primarily to Asia. For decades, foreign competitors seeking to control critical markets played a long game. Government investment and subsidies were effective in undercutting U.S. and European companies. As other countries created this unfair competitive advantage in manufacturing, the know-how also migrated in their direction. This resulted in the serious workforce challenges the semiconductor and printed circuit board industries face today.

Dave Brooks Celebrates 25 Years at IEC USA

03/26/2024 | IEC
Please join IEC (International Electronic Components) in congratulating Dave Brooks on 25 years of service and camaraderie. As one of the original members of the IEC USA team, Dave is a valuable contributor to IEC's continued success. 

MacDermid Alpha Electronics Solutions’ New Book Now Available for Download

03/27/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting. 

Green Circuits Unveils Innovative Stacked Capacitors Assembly Process

03/21/2024 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.

Happy’s Tech Talk #26: Balancing the Density Equation

03/14/2024 | Happy Holden -- Column: Happy’s Tech Talk
Printed circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit
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