TopLine and VPT Components Announce Column Attachment Services for RadHard FPGA Devices
November 18, 2019 | TopLineEstimated reading time: Less than a minute
Teresa Farris, TopLine Business Development Manager of Radiation Hardened Technology (RadHard) announces expanded collaboration and technical cooperation with VPT Components, a JANS-certified semiconductor manufacturer to provide CCGA column attachment services to the RadHard community as presented by Joe Benedetto, CEO of VPT Components at a recent RHET conference held in Melbourne, FL.
TopLine is a California-based manufacturer of copper-wrapped Pb80/Sn20 solder columns for ceramic column grid array (CCGA) packages.
Benedetto says that “VPT Components is working towards DLA certification with a goal of reaching QML Q-level qualification in early in 2020.”
Martin Hart, CEO of TopLine Corporation, remarks, “We are pleased to extend close technical cooperation and support to VPT Components, who serves as an independent contract assembler to provide column attachment services to the greater defense and aerospace industries. VPT has demonstrated excellent skills and workmanship with attaching TopLine made solder columns to FPGA devices.”
Benedetto add that, “There is a need in the radiation hardened IC community for faster turn-times. VPT developed a CCGA process using TopLine columns with excellent attachment and pull-strength test results. We are working on automating the process to give customers quick turn services at competitive pricing.”
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.