Reading time ( words)
The branches of military services continue to counter threats by shifting from boots on the ground to more technical solutions that do not require additional personal. The combat environment requires designs that require faster decisions and more rapid processing, rugged displays to withstand 120°F outside temperatures, extreme cold, blowing sand, and abnormal mechanical forces like the shock and vibration in a helicopter; they have to be smaller, lighter-weight, and extremely reliable.
Unmanned vehicles require more AI and associated technology. Electronic uniforms compliment camouflage and drive designs using electronic fabrics. For example, uniforms with cameras on the back of the soldier which project that image on the uniform front make the solder totally invisible (the ultimate in camouflage). Increased electronic guidance for more projectiles—including bullets, space warfare countermeasures, and cyber threats—push new technology and drive printed circuit features and their associated reliability. With the future demand for more and more military electronics, certification to the PCB MIL-PRF-31032 specification becomes a business decision for many fabricators. Fluency in the MIL-PRF-31032 language is a key first step to understand the requirements and communicate with the Department of Defense (DoD). This column will define many of these terms and is a must-review before informing the DoD of your intent to certify. Let’s take a look at these unique new words, including expanded definitions, and a quick-glance glossary.
To continue reading this column, head on over to your October 2019 issue of PCB007 Magazine.
Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.
Patty Goldman, I-Connect007
As a young industry professional, Paige Fiet, a process engineer at TTM Logan, sees mentorship as a formative component of her success in IPC. Alongside the support and guidance of her mentors, Paige has distinguished herself as an emerging leader who brings a fresh perspective to the many topics currently of interest to the industry.
Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.