Raytheon, DARPA Complete Key Design Review for New Hypersonic Weapon
July 29, 2019 | Raytheon CompanyEstimated reading time: 1 minute
Raytheon Company and DARPA completed a successful baseline design review for the Tactical Boost Glide hypersonic weapons program, establishing the company's technical approach for a critical design review and moving the system a step closer to development and use.
Hypersonic vehicles operate at extreme speeds and high altitudes. Raytheon is developing hypersonics for the U.S. Department of Defense.
A boost glide weapon uses a rocket to accelerate its payload and achieve hypersonic speeds – velocities greater than Mach 5. During flight, the payload separates from the rocket and glides unpowered to its destination.
"We understand the urgency of the need and are working fast to deliver this advanced technology to our nation's military," said Dr. Thomas Bussing, Raytheon Advanced Missile Systems vice president. "The goal is to keep America ahead of emerging threats, and we are well on our way."
The U.S. military will use hypersonic weapons to engage from longer ranges with shorter response times and with greater effectiveness than current weapon systems.
Earlier this year, Raytheon received a $63 million DARPA contract to further develop the Tactical Boost Glide program, a joint effort between the agency and the U.S. Air Force.
About Raytheon
Raytheon Company, with 2018 sales of $27 billion and 67,000 employees, is a technology and innovation leader specializing in defense, civil government and cybersecurity solutions. With a history of innovation spanning 97 years, Raytheon provides state-of-the-art electronics, mission systems integration, C5I® products and services, sensing, effects, and mission support for customers in more than 80 countries. Raytheon is headquartered in Waltham, Massachusetts.
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.