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PCB007 Magazine April 2024 — The Growing Industry Issue

04/15/2024 | I-Connect007 Editorial Team
After more than two decades of steady decline in the U.S., the PCB industry is finally growing in the West thanks to the CHIPS and Science Act, DoD funding, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act. The U.S. is now in a race to regain what was lost and then some. But what does “growing” look like for the organizations that have received DoD funding, and for the rest of us? How can we sustain this growth?

Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability

04/09/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.

SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA

04/09/2024 | SCHMID Group
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week.

Calumet Electronics Boosts PCB Production Capacity with Strategic CapX

04/05/2024 | Calumet Electronics
Calumet Electronics is proud to announce a significant expansion of its domestic printed circuit board (PCB) production capacity at its campus in Michigan’s Upper Peninsula. Over the last four years, Calumet has strategically invested in manufacturing equipment, workforce development, and campus expansion.

The IMAPS Show: A Conversation with John Andresakis

03/26/2024 | Marcy LaRont, PCB007 Magazine
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
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