IPC Issues Call for Participation for Electronics Materials Forum


Reading time ( words)

IPC−Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

The content of the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.

IPC is seeking presentations on emerging technologies challenging existing material sets, as well as the following topics of interest:

Substrate Materials:

  • Novel board laminates
  • Surface finishes
  • Solder mask advancements
  • Flexible/wearable circuits
  • HDI developments

Assembly Materials:

  • New solder alloys
  • Flux development
  • Cleaning chemistries
  • Assembly process strategies
  • Thermal interface solutions

Protective Materials:

  • Cleaning chemistries
  • Conformal coatings
  • Adhesive
  • Underfills

“While many future technologies can be envisioned, they cannot be fully developed without the materials and processes to manufacture them,” said Brook Sandy-Smith, IPC technical education program manager, “this conference is ideal for engineers and managers that procure materials or want to understand advancements in materials for the board, assembly, components, and protective layers.”

About IPC

IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share

Print


Suggested Items

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

Goepel electronic Solutions, Webinar Series, and Trends

06/19/2019 | Barry Matties, I-Connect007
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.



Copyright © 2019 I-Connect007. All rights reserved.