Top 10 Most-Read SMT007 Articles for March


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Starting today, we will take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles for the month of March. Check them out.

1. RTW IPC APEX EXPO 2019: Aculon on Technology Developments and Partnership with Henkel

Aculon CEO Edward Hughes and Editor Pete Starkey discuss surface modification technologies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic partnership with Henkel opens up new opportunities.

2. Accelerating and Disrupting Innovation: The Tesla Story

The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.

3. Automation and the Smart Factory: Introduction to Industry 4.0

The characteristics of successful automation application in manufacturing depend on how well business and technical management understand and promote the strategies, tactics, and philosophies used in modern manufacturing. This article briefly outlines the background of computer-integrated manufacturing (CIM) and its evolution to Industry 4.0 and smart factories.

4. Two Full CFX Demo Lines at IPC APEX EXPO 2019

During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.

5. Digi-Key’s Dave Doherty: Tweaking the Supply Chain

In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.

6. RTW IPC APEX EXPO 2019: Five-year Standard Committee Collaboration on JS-001

David Hillman from Collins Aerospace and IPC's Teresa Rowe speak with Editor Dan Feinberg about how a seemingly simple question resulted in years of committee work to develop the JS-001 standard on the use of conformal coatings and avoiding tin whiskers.

7. Stephanie Martin: Component Supply Challenges from the Catbird Seat

Vexos Senior Vice President for Global Supply Stephanie Martin gives the I-Connect007 editorial team a wide-ranging and insightful overview of the current parts supply situation from the perspective of procurement at a contract manufacturer.

8. Jennie Hwang: Get Ready for Disruptive Technologies

At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?

9. RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

10. Industry Outlook from IPC's Sharon Starr

Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

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The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.



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