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The SMTA has named the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Richard Coyle, Ph. D., Nokia Bell Labs and a team of co-authors from the iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project won the Best of Proceedings category for the paper "Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys." David Hillman and co-authors from Collins Aerospace (formerly Rockwell Collins), came in second for the paper “Dissolution Rate of Specific Elements in SAC305 Solder.” Richard Coyle, Ph.D., Nokia Bell Labs, David Ihms, Ph.D., Delphi Technologies, and additional co-authors from the iNEMI QFN Board Level Reliability Project took third place for the paper “The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages.”
The winner from SMTA International 2018 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Kazuhiro Nogita, The University of Queensland, for the presentation entitled "The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates." The award is based on the conference attendees' rating of each speaker at the technical session.
Best Student Presentation was awarded to Vishnu Reddy, Georgia Tech, for his paper “Assessment of 2nd level interconnect quality in Flip Chip Ball Grid Array (FCBGA) Package using Laser Ultrasonic Inspection Technique.”
The authors will formally be presented their awards at the annual meeting and keynote session during SMTA International on September 22-26, 2019 in Rosemont, Illinois. Abstracts can be uploaded directly on-line and will be accepted through March 1, 2019.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.