Words of Advice: Streamlining Your Design Process

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In a recent Design007 Survey, we asked the following question: What would help you streamline your design process? Here are just a few of the answers, edited slightly for clarity.

Scott Decker, Collins Aerospace: A process that’s been defined and used. We don’t need no stinking process…YES we do!

Jon Ashton, Vergent Products: Easier DFM rule setup for checks, and easier design rule setup for layout. Manufacturer data sheets should use package details that are orientated correctly.

Jose Moreira, Advantest: We need more experienced resources.

09/17/2020 | Andy Shaughnessy, Design007 Magazine

I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

09/09/2020 | I-Connect007 Editorial Team

The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

08/13/2020 | Happy Holden, I-Connect007

We asked for you to send in your questions for Happy Holden, and you took us up on it! We loved them so much, and we know that you did too, so we’ve compiled all 21 questions and answers into one document for easy reference.