Ventec at electronica 2018: No Compromises for High-Frequency Materials


Reading time ( words)

Ventec International Group will announce the launch of its extended ceramic-filled hydrocarbon thermoset material series designed for the world's most demanding high-frequency printed circuit board applications at this year’s electronica show in Munich. The global Ventec team will also be on hand in hall A1 at booth #468 to present the company’s unique laminate and prepreg capability across a very wide range of applications and budgets under the theme of ‘No more compromises: Price, Performance and Availability.'

From 13-16 November, electronica 2018 will be the global launch platform for Ventec's extended tec speed 20.0 range of ceramic-filled hydrocarbon thermoset material series. Combining unrivalled high-frequency performance (Dk 3.00-3.48/Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec's fully controlled and managed global supply chain and technical support-network, the tec-speed 20.0 series offers excellent dimensional stability and uniform mechanical properties that help limit PIM. With the extended tec speed 20.0 range, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.

Other show highlights include:

Material Showcase  

A special product & material showcase will demonstrate PCB material applications including a power module and a LED lighting module that illustrates examples of IMS boards combined with FR4 control boards made with Ventec’s high performance and highly reliable IMS materials like VT-4B5SP, VT-4B5L and VT-4B7. Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.

Announcing European Distribution Agreement for Thermal Interface Materials

As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, Ventec has teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) to the European market. TIM is a thermally conductive medium used to fill the air gaps between mating surfaces in electronic components. Air is a poor conductor of heat and creates a thermal barrier which stops the transfer of heat between the component and its heatsink or chassis. EMI Thermal’s range of materials distributed through Ventec includes double sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.

With a one-stop-service solution for customers, Ventec also offers further distribution products to the European PCB and electronics industry including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and speciality (Centrum & Glossback) drill materials, copper foils including ACF.

Stock exchange Listing Celebration

Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. To celebrate the successful IPO as well as the launch of its latest product offerings, Ventec is looking forward to hosting show-visitors at its booth party on Wednesday, 14 November from 18:00 to 21:30.

About Ventec International Group

With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

iNEMI’s PCB Roadmap Explained

05/01/2020 | Pete Starkey, I-Connect007
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

Improving Copper Distribution in Pattern Plating Using Simulation Software

04/28/2020 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey had the opportunity to sit in on a webinar presented by Robrecht Belis, manager of the surface finishing business unit at Elsyca—a Belgian company specialising in the simulation of electrochemical processes.

IPC Europe Shares Technical Education and Standards Awareness

04/22/2020 | Pete Starkey, I-Connect007
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.