IPC Europe Forum Call for Papers: Innovation for Reliability


Reading time ( words)

IPC is seeking presentations for its 3rd Annual High Reliability Forum for Electronics Subjected to Harsh Use Environments. IPC is interested in presentations on the following topics:

  • Mechanical stress reliability — vibration and shock Methods (software) for predicting reliability
  • Failure Modes Effects Analysis (FMEA)
  • Thermal Mitigation
  • Thermal Stress Test Methods
  • HDI Reliability
  • Microvia Failures and Testing Methods
  • Microvia Reliability
  • Design for Reliability
  • Design Rules for Spacing and Staggered Vias
  • Failures Related to Laminate Materials
  • Materials Compatibility
  • System-level effects on Solder Joint Reliability
  • Assembly Tests for Solder Joint Reliability

Presentations should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations should be 45 minutes, including time for questions and answers.

Staff from companies such as NASA Goddard Space Flight Center, Honeywell Aerospace, Lockheed Martin Missiles and Fire Control, Motorola and Raytheon have presented papers at past IPC High Reliability Forums.

If you’re interested in presenting at this important industry event, please submit a brief abstract along with the title of your presentation to AliciaBalonek@ipc.org.

Share

Print


Suggested Items

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Who’s the Best of the Best in Hand Soldering?

01/11/2019 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.

More Than Inspection: It’s Process Improvement

01/09/2019 | Barry Matties, I-Connect007
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.



Copyright © 2019 I-Connect007. All rights reserved.