SemiGen Strengthens PCB Assembly, Test Capabilities


Reading time ( words)

After moving into their new state-of-the- art facility, SemiGen Inc., an ISO and ITAR registered outsource for RF and microwave contract assembly, automated PCB assembly (PCBA), wafer-processing, and key diodes, semiconductor devices, and bonding supplies, has made an additional capital investment of over a half million dollars in new production, wafer fab, and testing equipment to support customer demand.

The new equipment consists of improvements across their entire service platform and includes a new Mycronic MY300 pick-and-place system; two new Westbond wire bonders, a new Centrotherm eutectic vacuum chamber, new HTOL / HTRB ovens; as well as a new Disco DAD3220 dicing saw. In addition, they’ve made upgrades in their high-frequency testing department which includes several new pieces of performance testing and metrology tools.

"I'm excited to be in a position to continue to invest in and grow this important domestic outsource business," said Tim Filteau, president of SemiGen. "Our CEO, Jim Morgan, has said we must do our best to help our customers augment their design, assembly, and hi-rel testing and up-screening capabilities, and it feels great to see this new equipment getting up and running to do just that."

SemiGen is a USA-based outsource to OEMs in the RF/microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their services and products are designed to fill voids in the manufacturing supply chain and production floor. SemiGen’s design and manufacturing center includes wire bonding to Si, GaAs, and GaN chips, RF/microwave and PCB assembly, mixed signal digital and analog assembly, module repair, and high frequency testing and upscreening services. In recent years, SemiGen has invested in coupling their services with in-stock product solutions by carrying the diodes, active and passive semiconductor devices, and bonding supplies needed for successful production of several types of solid-state, multi-function assemblies (MFAs) and components.

Their team helps with designs, builds prototypes, and handles volume production runs within new their 37,000 square foot facility in Manchester, New Hampshire. The facility also includes a class 10,000 clean room. Manual to fully automatic assembly solutions are now available. 

With their recent upgrades in place, SemiGen is also offering wafer processing of silicon wafers, as well as processing ceramic substrates. Processing services provided include any combination of photolithography, wet etch, dry etch, metallization, grinding, polishing, and in-process metrology.

Their recent investments in their RF and Microwave testing and environmental screening lab has also enabled them to offer high-reliability (Hi-rel) screening of amplifiers, FETs, MMICs, transistors, diodes, and other RF and microwave components operating up into millimeter-wave frequencies.

Tests can be performed and delivered with full documentation in adherence with MIL-PRF-19500, MILPRF-38534, and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level, as well as custom SCD driven requirements, are available.

Share

Print


Suggested Items

Oren Manor on the Siemens-Mentor Integration

11/26/2019 | Real Time with...productronica
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.