Metcal to Exhibit at SMTA Ohio Valley Expo


Reading time ( words)

Metcal will exhibit its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil and Solder Tip Cleaner, at the SMTA Ohio Expo & Tech Forum, scheduled to take place July 12, 2018 at the Embassy Suites Cleveland Rockside in Cleveland.

Built on the company's SmartHeat technology used in all Metcal soldering systems, CV evaluates the quality of the solder joint by calculating the intermetallic compound formation and providing closed-loop feedback to the operator, mitigating risk in the process. Metcal will introduce the latest CV system accessories at the show, a full set of hand-pieces including tweezers, desolder and high thermal demand that will transform the CV-5200 soldering system into a complete rework solution. Additionally, Metcal has released the CV Monitoring Software that will improve solder process traceability and create a performance baseline to quickly analyze soldering performance, identify changes in solder conditions, and allow users to make changes to their process.

The new Digital Hot Air Pencil was developed for very small surface mount component and package sizes (1206s and smaller) and low board densities. Metcal's Solder Tip Cleaner, meanwhile, features a replaceable brush system that pulls excess solder away from the tip into a removable collection tray for disposal while removing oxidation from the tip, thereby extending the life of the solder tip.

About Metcal

Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.

Share


Suggested Items

Greatest Challenges in Soldering

12/12/2018 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/12/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Greg Vance on SMTA Ohio Chapter Updates

12/05/2018 | I-Connect007 Editorial Team
This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.



Copyright © 2018 I-Connect007. All rights reserved.