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The Solder Tip

05/03/2023 | Barry Matties, I-Connect007
During the recent SMTA Boise Expo & Tech Forum, I spoke about hand soldering with Craig Morris, an area sales manager at JBC Tools, a company that has served the global electronics industry for decades. In this interview, Craig shares some of the latest developments in his company’s soldering tool, which allows the technician to use time, technique, and temperature to improve the finished product.

The Shaughnessy Report: PCB Design and Advanced Packaging

01/11/2023 | Andy Shaughnessy -- Column: The Shaughnessy Report
It’s hardly an exaggeration to say that 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, which pointed out how far the United States has fallen behind the rest of the world in microelectronics. A few months later, the weeklong IPC Advanced Packaging Symposium took place in Washington, D.C., and I-Connect007 covered this event from start to finish. One thing we learned from the symposium: There’s a great deal of innovation taking place in advanced packaging right now, and it all starts with PCB designers and design engineers making the correct decisions early in the design cycle.

Intel, Mila Join Forces for Responsible AI

09/15/2022 | Intel
Intel has announced a three-year strategic research and co-innovation collaboration with Mila, an artificial intelligence research institute based in Montreal.

Knocking Down the Bone Pile: Soldering for QFPs and Other Gull Wing Leaded Parts

08/16/2022 | Bob Wettermann -- Column: Knocking Down the Bone Pile
There are multiple methods for hand soldering QFPs as outlined in the IPC 7711.21 Rework and Repair of Printed Circuit Assemblies process guidelines document. QFPs have several challenges related to their hand soldering especially when the component has a high lead count. While these are a head-spinning number of techniques, this discussion will concentrate on some of the more widely used techniques: drag, and point-to-point soldering as well as the adhesive-backed stencil technique.

Knocking Down the Bone Pile: Solder Mask Repair Techniques for PCB Repair

03/08/2022 | Bob Wettermann -- Column: Knocking Down the Bone Pile
One of the most common physical repairs (restoring functional capability of a defective PCB while not complying to meet original specifications) on a PCB is the repair of solder mask. Solder masks’ purpose is to prevent solder from flowing from one point to another during the original assembly process. Damage to solder mask can be aesthetic or functional in nature such as the case when the mask preventing solder from flowing down the “dog bone” of a BGA causes the BGA ball solder joint to be “starved” thereby causing a defect.
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