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More powerful LED applications demand an increased focus on thermal management. More powerful LEDs produce more heat and temperature rise has an impact on the short-term function of a LED part such as color shift and reduced light output.
The long-term effects shouldn’t be neglected either. Higher operating temperatures can result in a reduced life time.
To reduce the operating temperature, and thus the impact of the temperature on LED applications or power converters, Eurocircuits has upgraded its IMS material. The formerly used Polytherm TC-Lam 1.3 is now succeeded by Polytherm TC-Lam 2.0.
The main difference is the dielectric. This thermally conductive layer has better properties, such as thermal conductivity of 2.0 W/mK (upgrade from 1.3 to 2.0), and thermal resistance: 0.50 K/W (lowering from 0.77 to 0.5).
The thick aluminum (alloy 5052) layer remains the same and is responsible for the heat dissipation. The copper foil on the opposite side is still 35 microns thick. This copper layer forms the base for the circuit. Other service parameters remain unchanged.
07/12/2018 | Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.
07/10/2018 | Pete Starkey, I-Connect007
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.
07/09/2018 | Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.