Rogers Unveils New Process Improvement Option for Flex Heater Dielectrics


Reading time ( words)

Rogers Corporation is pleased to introduce ARLON raPId polyimide substrates, a new, innovative solution for streamlining manufacturing and improving performance of flexible heater applications. Designed with a revolutionary new construction, raPId substrates incorporate the benefits of polyimide heater dielectrics with the flexibility and usability of a silicone adhesive system. 

Replacing traditional acrylic or fluorinated ethylene propylene (FEP) adhesive systems, ARLON raPId substrates combine polyimide film with a unique silicone adhesive that processes in less time and at lower temperatures and pressure. These features make a big difference during manufacturing as the innovative thermosetting silicone adhesive system locks the foil-etched circuit in place, minimizing circuit “swimming” during capping, while minimizing delamination and voids. By streamlining processing, ARLON raPId substrates reduce cure temperatures, pressures, and cycle times, resulting in lower manufacturing cost and higher product value.

Available in both etched-foil and wire-wound dielectric offerings, ARLON raPId substrates are ideal for high-reliability applications as a replacement for acrylic or FEP adhesives in polyimide flexible heaters. In applications where temperature control is vital, these unique substrates can be used to maintain temperatures in analytical test equipment with a chemical-resistant heater or in outdoor electronics requiring cold weather operation via ultra-low-profile heater constructions. Their robust construction is also attractive for low-weight heaters for aerospace applications where protecting devices against cold temperatures at high altitudes is critical. For medical equipment requiring faster-response-rate heating systems, these innovative substrates can improve reliability and performance, while minimizing processing challenges.

Tim Wilson, Rogers’ Market Segment Manager for the ARLON suite of products states, “We’re excited to be introducing raPId Flex Heater Dielectric. By combining the technologies of a polyimide heater dielectric with the robustness of silicone adhesives, raPId substrates are the solution of choice for applications in which temperature control is mission-critical.”

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.

Share




Suggested Items

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

An Inside Look at an Indian PCB Manufacturer

03/24/2022 | Dan Beaulieu, D.B. Management Group
As a student of the printed circuit board industry, I am always interested in learning more about companies all over the world. When I connected with Abhay Doshi, managing director of Fine-Line Circuits Ltd. in India, I welcomed the opportunity to learn more about him, his company, and the Indian PCB business as a whole—it was all that, and so much more. Here’s what I learned.

EIPC Technical Snapshot: A European Roundup

03/02/2022 | Pete Starkey, I-Connect007
Although it was originally proposed to hold a one-day face-to-face EIPC conference in Frankfurt, travel restrictions in Germany made this impractical. But the Technical Snapshot webinar format has proved so successful that it was decided to run an extended version as an alternative—two sessions, with three presentations each. It worked extremely well. The carefully selected program on February 23 featured excellent speakers, and seamless organisation added up to an outstanding event.



Copyright © 2022 I-Connect007. All rights reserved.