RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing


Reading time ( words)

Jack Pattie, president of Ventec International Group, comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.

Download Ventec’s ebook on designing for thermal management here.

To watch the interview, click here.

Share

Print


Suggested Items

Institute of Circuit Technology Spring Seminar 2020

03/11/2020 | Pete Starkey, I-Connect007
Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.

2020 EIPC Winter Conference, Day 1

03/09/2020 | Pete Starkey, I-Connect007
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

Ventec’s Materials are Enablers for 5G, Industry 4.0

02/26/2020 | I-Connect007 Editorial Team
In this video interview from the show, Technical Editor Pete Starkey and Ventec COO for Europe and the Americas Mark Goodwin discuss Ventec’s latest high-speed, low-loss, high-frequency materials as enablers for 5G and Industry 4.0.



Copyright © 2020 I-Connect007. All rights reserved.